Fabrication Of Multiple Wavelength Vertical-cavity Surface-emitting Laser Array Using Flip-chip Bonding

Abstract

Two-dimensionally integrated multiple wavelength arrays using VCSELs or VCSEL-based optical functional device arrays such as V S W s are expected to provide a wider-bandwidth and improved functionality, such as wavelength addressing.') A multiple wavelength VCSEL array, grown with a specific thickness grading, can provide fixed wavelength separation.2) To fully utilize the advantages of the multiple wavelength scheme, a more flexible fabrication technique is needed for providing the arrays with the desired wavelength separation or distribution, such as periodic distribution.