Interconnect length impact investigation by measurements

Michael Sotman, Alexey Kostinsky, Genadiy Zobin, Intel Israel
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Abstract

The paper describes novel methodology for high frequency link/bus validation. For the first time the entire interconnect length range is covered. Frequency shmoo emulates PCB length change. The discovered resonance behavior correlates perfectly with theoretical prediction.
互连长度影响的测量研究
本文描述了一种新的高频链路/总线验证方法。这是第一次覆盖整个互连长度范围。频率shmoo模拟PCB长度变化。发现的共振行为与理论预测完全吻合。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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