ATLASPIX3 Modules for Experiments at Electron-Positron Colliders

Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022) Pub Date : 2023-03-13 DOI:10.22323/1.420.0086

R. Zanzottera, A. Andreazza, F. Sabatini, F. Palla, F. Bosi, A. Petri, A. Carbone, L. Meng, H. Fox, I. Perić, R. Schimassek, R. Dong, Y. Gao, J. Velthuis, J. Dopke, F. Wilson, D. Muenstermann, Y. Li, X. Xu, T. Jones

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Abstract

High-voltage CMOS detectors are being developed for application in High-Energy Physics. AT-LASPIX3 is a full-reticle size monolithic pixel detector, consisting of 49000 pixels of dimension 50 × 150 𝜇 m 2 . It has been realized in in TSI 180 nm HVCMOS technology. In view of applications at future electron-positron colliders, multi-chip-modules are built. The module design and its characterization by electrical test and radiation sources will be illustrated, including characterization of shunt regulators for serial chain powering. Lightweight long structure to support and to cool multiple-module chain are also being realized. The multi-chip-modules performance shows no degradation with respect to single-chip devices and the level of integration achieved is suitable for tracking at future 𝑒 + 𝑒 − accelerators.

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正负电子对撞机实验用ATLASPIX3模块

高压CMOS探测器正被开发用于高能物理。AT-LASPIX3是一个全光栅尺寸的单片像素探测器，由49000个像素组成，尺寸为50 × 150 μ m 2。它已在TSI 180 nm HVCMOS技术中实现。考虑到未来正负电子对撞机的应用，构建了多芯片模块。该模块的设计及其特性的电气测试和辐射源将被说明，包括特性的并联稳压器的串联链供电。支撑和冷却多模块链的轻量化长结构也正在实现。与单芯片器件相比，多芯片模块的性能没有下降，并且实现的集成水平适用于未来𝑒+𝑒−加速器的跟踪。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)

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