Novel Hybrid Wired-Wireless Network-on-Chip Architectures: Transducer and Communication Fabric Design

Abstract

Existing wireless communication interface of Hybrid Wired-Wireless Network-on-Chip (WiNoC) has 3-dimensional free space signal radiation which has high power dissipation and drastically affects the received signal strength. In this paper, we propose a CMOS based 2-dimensional (2-D) waveguide communication fabric that is able to match the channel reliability of traditional wired NoCs as the wireless communication fabric. Our experimental results demonstrate that, the proposed communication fabric can achieve a 5dB operational bandwidth of about 60GHz around the center frequency (60GHz). Compared to existing WiNoCs, the proposed communication fabric can improve the reliability of WiNoCs with average gains of 21.4%, 13.8% and 10.6% performance efficiencies in terms of maximum sustainable load, throughput and delay, respectively.