Electronic-photonic integration for government applications

2017 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP) Pub Date : 2017-11-01 DOI:10.1109/AVFOP.2017.8169767

P. Juodawlkis, S. Bramhavar, J. Chiaverini, D. Kharas, W. Loh, R. Maxson, S. Mouser, J. Plant, J. Sage, C. Sorace-Agaskar, R. Swint, S. Yegnanarayanan

引用次数: 0

Abstract

We provide an overview of electronic-photonic integration techniques and describe our recent work to develop monolithic and hybrid photonic components and integrated circuits (PICS) realized in several material platforms (silicon, silicon nitride, compound semiconductors) for a variety of government applications.

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政府应用的电子-光子集成

我们概述了电子-光子集成技术，并描述了我们最近在几种材料平台(硅，氮化硅，化合物半导体)上开发的单片和混合光子元件和集成电路(PICS)的工作，用于各种政府应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference (AVFOP)

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