An advanced telecom packaging concept ensuring higher reliability and low cooling energy costs

Abstract

The author describes a modular liquid-cooled packaging design based primarily on heat conduction principles (abandonment of natural air convection). It is being used both in an existing Telex exchange design and in trials with a pilot AC/DC power supply system (MS 2000 with water-cooled rectifiers) using a water chiller designed according to the Ascom concept. Energy consumption measurements using the water chiller prototype show even at this early stage that this cooling concept can achieve energy savings that are far from trivial.<>