Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications

IEEE Custom Integrated Circuits Conference 2006 Pub Date : 2006-12-01 DOI:10.1109/CICC.2006.320994

Kohei Onizuka, H. Kawaguchi, M. Takamiya, T. Kuroda, T. Sakurai

引用次数: 39

Abstract

A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700 times 700mum on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed

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用于SiP应用的片对片感应无线电力传输系统

提出了一种芯片对芯片的感应无线电力传输系统，并首次通过实验验证了该系统的可行性。该电路在输出直流电压0.5V下，利用700个700mum片上平面电感作为发射器和接收器，实现了2.5mW功率的传输。讨论了以最大传输功率为目标优化电路设计的方法和仿真优化结果

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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IEEE Custom Integrated Circuits Conference 2006

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