A new high voltage IC with robust isolation design

V. Ningaraju, Horng-Chih Lin, Po-An Chen, Ji Wen
{"title":"A new high voltage IC with robust isolation design","authors":"V. Ningaraju, Horng-Chih Lin, Po-An Chen, Ji Wen","doi":"10.1109/VLSI-TSA.2018.8403845","DOIUrl":null,"url":null,"abstract":"A new and robust isolation design for control devices integrated in the high side island region of 250V high-voltage integrated circuits (HVIC) is proposed and verified by numerical calculations, simulations and experiments. The new isolation structure can be realized using micro N-well in the P-type isolation region to achieve a higher breakdown voltage (BV). The measurement and TCAD simulation results prove this new isolation structure's BV is over 350V with negligible leakage current. In the proposed scheme BV is improved by 15% more than the conventional structure without adding additional process steps and photo layers.","PeriodicalId":209993,"journal":{"name":"2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2018.8403845","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

A new and robust isolation design for control devices integrated in the high side island region of 250V high-voltage integrated circuits (HVIC) is proposed and verified by numerical calculations, simulations and experiments. The new isolation structure can be realized using micro N-well in the P-type isolation region to achieve a higher breakdown voltage (BV). The measurement and TCAD simulation results prove this new isolation structure's BV is over 350V with negligible leakage current. In the proposed scheme BV is improved by 15% more than the conventional structure without adding additional process steps and photo layers.
一种新型高压集成电路,具有强大的隔离设计
针对250V高压集成电路(HVIC)高侧岛区集成的控制器件,提出了一种新的鲁棒隔离设计方案,并通过数值计算、仿真和实验进行了验证。这种新型隔离结构可以在p型隔离区内利用微n阱实现更高的击穿电压(BV)。测试和TCAD仿真结果表明,这种新型隔离结构的BV大于350V,漏电流可以忽略不计。在不增加额外的工艺步骤和光层的情况下,BV比传统结构提高了15%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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