A. Tang, F. Hsiao, D. Murphy, I-Ning Ku, J. Liu, Sandeep D'Souza, N. Wang, Hao Wu, Yen-Hsiang Wang, Mandy Tang, G. Virbila, Mike Pham, Derek Yang, Q. Gu, Yi-Cheng Wu, Yen-Cheng Kuan, C. Chien, Mau-Chung Frank Chang
{"title":"A low-overhead self-healing embedded system for ensuring high yield and long-term sustainability of 60GHz 4Gb/s radio-on-a-chip","authors":"A. Tang, F. Hsiao, D. Murphy, I-Ning Ku, J. Liu, Sandeep D'Souza, N. Wang, Hao Wu, Yen-Hsiang Wang, Mandy Tang, G. Virbila, Mike Pham, Derek Yang, Q. Gu, Yi-Cheng Wu, Yen-Cheng Kuan, C. Chien, Mau-Chung Frank Chang","doi":"10.1109/ISSCC.2012.6177029","DOIUrl":null,"url":null,"abstract":"The available ISM band from 57-65GHz has become attractive for high-speed wireless applications including mass data transfer, streaming high-definition video and even biomedical applications. While silicon based data transceivers at mm-wave frequencies have become increasingly mature in recent years [1,2,3], the primary focus of the circuit community remains on the design of mm-wave front-ends to achieve higher data rates through higher-order modulation and beamforming techniques. However, the sustainability of such mm-wave systems when integrated in a SoC has not been addressed in the context of die performance yield and device aging. This problem is especially challenging for the implementation of mm-wave SoC's in deep sub-micron technology due to its process & operating temperature variations and limited ft / fmax with respect to the operation frequency.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"28","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2012.6177029","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 28
Abstract
The available ISM band from 57-65GHz has become attractive for high-speed wireless applications including mass data transfer, streaming high-definition video and even biomedical applications. While silicon based data transceivers at mm-wave frequencies have become increasingly mature in recent years [1,2,3], the primary focus of the circuit community remains on the design of mm-wave front-ends to achieve higher data rates through higher-order modulation and beamforming techniques. However, the sustainability of such mm-wave systems when integrated in a SoC has not been addressed in the context of die performance yield and device aging. This problem is especially challenging for the implementation of mm-wave SoC's in deep sub-micron technology due to its process & operating temperature variations and limited ft / fmax with respect to the operation frequency.