Lithography-less ion implantation technology for agile fab

Abstract

A new type of ion implanter developed for an agile fab can eliminate the processes concerned with photo resist lithography from the ion implantation process. This new ion implantation technology can reduce the row process time, footprint, and the cost of ownership to less than 1/2 that of conventional ion implantation technology. We are making further developments on this ion implanter and evaluating technical issues related to ion implantation, a technique suitable for manufacturing submicron IC devices. Based on the results of evaluating the prototype machine, we will produce the next /spl beta/-machine.