From 2D to 3D NoCs: A case study on worst-case communication performance

Yue Qian, Zhonghai Lu, Wenhua Dou
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引用次数: 31

Abstract

Advanced integration technologies enable the construction of Network-on-Chip (NoC) from two dimensions to three dimensions. Studies have shown that 3D NoCs can improve average communication performance because of the possibility of using the additional dimension to shorten communication distance. In this paper, we present a detailed case study on worst-case communication performance in regular k-ary-2-mesh networks. Through both analysis and simulation, we show that, while 3D networks achieve better average performance, this may not be the case for worst-case performance mainly due to constraints on vertical channels. Our analysis is based on network calculus, which allows to calculate theoretical delay bounds for constrained flows traversing network elements. Categories and Subject Descriptors B.4 [Input/Output and Data Communications]: Performance Analysis and Design Aids General Terms Design, Performance
从2D到3D noc:最坏情况下通信性能的案例研究
先进的集成技术使片上网络(NoC)的构建从二维变为三维。研究表明,三维noc可以提高平均通信性能,因为可以使用额外的维度来缩短通信距离。在本文中,我们给出了一个详细的案例研究在规则k-ary-2-mesh网络的最坏情况下的通信性能。通过分析和模拟,我们表明,虽然3D网络实现了更好的平均性能,但由于垂直通道的限制,最坏情况下的性能可能并非如此。我们的分析是基于网络演算,它允许计算理论延迟界的约束流遍历网络元素。类别和主题描述符B.4[输入/输出和数据通信]:性能分析和设计辅助工具
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CiteScore
4.60
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