A simplified spice based IGBT model for power electronics modules evaluation

F. Chimento, N. Mora, M. Bellini, I. Stevanovic, S. Tomarchio
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引用次数: 14

Abstract

The paper deals with the evaluation of a suitable model for power IGBTs targeted for use in power electronic modules. The main issue for the developed model is the possibility of creating a circuital based structure starting from the device physical equations. The model is implemented in a circuital simulation environment with the aim of evaluating the performance of high voltage, high current modules. In those a key factor is the possibility of having computation times fitting with the necessity of parasitic elements estimation. The implementation of the model is described together with the validation of it by comparison with experimental results.
基于spice的电力电子模块评估简化IGBT模型
本文讨论了用于电力电子模块的功率igbt的合适模型的评估。开发模型的主要问题是从器件物理方程开始创建基于电路的结构的可能性。该模型是在电路仿真环境中实现的,目的是评估高电压、大电流模块的性能。其中一个关键因素是计算次数是否与寄生元素估计的必要性相匹配。介绍了模型的实现,并与实验结果进行了对比验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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