A Multi Channel Down-converter Module Exploiting Recent Advances in Multi layer RF Packaging Techniques

2006 European Microwave Integrated Circuits Conference Pub Date : 2006-09-01 DOI:10.1109/EMICC.2006.282675

S. Rumer, M. Thornber

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Abstract

Recent advances in the design of digital signal processing (DSP) equipments have broadened the appeal of this technology to satellite customers. Each digital signal processor has up and down converters associated with it in order to interface with the rest of a payload RF subsystem, consequently the need for multi-channel frequency converters that can provide a low cost per channel solution is now of increasing importance. The subject of this paper is the design of such a multi channel down-converter that provides an L band to Baseband frequency conversion, which has typically 100-200 channels. The key factor in achieving the desired low cost per channel is the use of a multi layer, multi RF channel, high temperature cofired ceramic tile. This complex tile incorporates RF tracks as well as DC interconnections and local oscillator signal distribution. The module design presented in this paper uses 13 hybrids per RF channel, thus having 104 hybrids for a fully populated 8 channel down-converter module. This has been designed and developed by EADS Astrium UK as part of the next generation processor (NGP) development jointly funded with ESA

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利用多层射频封装技术最新进展的多通道下变频模块

数字信号处理(DSP)设备设计的最新进展扩大了该技术对卫星用户的吸引力。每个数字信号处理器都有与其相关联的上下转换器，以便与有效载荷RF子系统的其余部分接口，因此对能够提供低成本每通道解决方案的多通道频率转换器的需求现在变得越来越重要。本文的主题是设计这样一个多通道下变频器，提供L波段到基带的频率转换，通常有100-200个通道。实现每个通道所需的低成本的关键因素是多层、多射频通道、高温共烧瓷砖的使用。这种复杂的瓷砖结合了射频轨道以及直流互连和本地振荡器信号分布。本文提出的模块设计在每个RF通道使用13个混合电路，因此在一个完全填充的8通道下变频模块中有104个混合电路。这是由EADS Astrium英国公司设计和开发的，作为与ESA共同资助的下一代处理器(NGP)开发的一部分

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2006 European Microwave Integrated Circuits Conference

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