S. Kanazawa, T. Ohkubo, T. Adachi, M. Inokuchi, A. Shibuya
{"title":"Flow visualization of a particle deposition on silicon wafers in clean rooms","authors":"S. Kanazawa, T. Ohkubo, T. Adachi, M. Inokuchi, A. Shibuya","doi":"10.1109/IAS.1991.178239","DOIUrl":null,"url":null,"abstract":"Flow field around silicon wafer in a clean room is discussed on the basis of experimental results obtained using smoke visualization and the Schlieren method. Several examples of flow pattern are presented to show the influence of aerodynamic conditions on particle transportation. The characteristic flow phenomena around stagnation point flow and vortices generated behind the wafer are made clear from the observed streamlines by the Schlieren method. The observed flow field for the vertical airflow over a horizontal wafer is compared with the simulation result given in Liu et al. (1987). The dependence of airflow on wafer surface temperature is also discussed. Results show that the fluid flow for a normal condition is an axisymmetric flow, while, for a wafer heated condition, the behavior of fluid flow is changed extremely and the effect of thermal convection is dominant compared with the main downward air flow.<<ETX>>","PeriodicalId":294244,"journal":{"name":"Conference Record of the 1991 IEEE Industry Applications Society Annual Meeting","volume":"71 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-09-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the 1991 IEEE Industry Applications Society Annual Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IAS.1991.178239","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Flow field around silicon wafer in a clean room is discussed on the basis of experimental results obtained using smoke visualization and the Schlieren method. Several examples of flow pattern are presented to show the influence of aerodynamic conditions on particle transportation. The characteristic flow phenomena around stagnation point flow and vortices generated behind the wafer are made clear from the observed streamlines by the Schlieren method. The observed flow field for the vertical airflow over a horizontal wafer is compared with the simulation result given in Liu et al. (1987). The dependence of airflow on wafer surface temperature is also discussed. Results show that the fluid flow for a normal condition is an axisymmetric flow, while, for a wafer heated condition, the behavior of fluid flow is changed extremely and the effect of thermal convection is dominant compared with the main downward air flow.<>
基于烟雾可视化和纹影法的实验结果,讨论了洁净室中硅片周围的流场。文中列举了几个流型的例子来说明气动条件对颗粒输运的影响。用纹影法从观察到的流线上清晰地显示了晶圆周围的滞止点流动和晶圆后产生的涡的特征流动现象。将观测到的水平薄片上垂直气流的流场与Liu et al.(1987)给出的模拟结果进行了比较。文中还讨论了气流对晶圆表面温度的影响。结果表明:在正常条件下,流体流动为轴对称流动,而在加热条件下,流体的流动行为发生了极大的变化,与主要的向下气流相比,热对流的作用占主导地位