Compact IPMs in transfer mold packages for low-power-motor drives

Abstract

This paper presents an excellent power module family for low power motor drives. The DIP-IPM (dual in-line package intelligent power module), with its transfer-mold packaging concept, is the most popular device, especially in today's consumer inverter market, for its cost-effective performance and high reliability. In this paper, the features of this kind of IPM and the background technologies supporting this successful device family are described.