{"title":"Wireless Power Transfer through Low-E Glass","authors":"Shengming Shan, Vincent Hsiao, R. Hwang","doi":"10.1109/WPTC45513.2019.9055631","DOIUrl":null,"url":null,"abstract":"Delivering power wirelessly and efficiently through low-e glass window is critical for successful deployment of 5G Fixed Wireless Access services. This research reports the effect of low-emissivity glass on wireless power transfer using magnetic-field resonant coupling technique. The hybrid electromagnetic-circuit method is employed to formulate the input-output relation of the power at transmit- and receive-coils, particularly in the presence of low-emissivity (e) glass. The equivalent circuit model of the low-e glass is developed to integrate the structure/material into circuit analysis.","PeriodicalId":148719,"journal":{"name":"2019 IEEE Wireless Power Transfer Conference (WPTC)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE Wireless Power Transfer Conference (WPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WPTC45513.2019.9055631","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Delivering power wirelessly and efficiently through low-e glass window is critical for successful deployment of 5G Fixed Wireless Access services. This research reports the effect of low-emissivity glass on wireless power transfer using magnetic-field resonant coupling technique. The hybrid electromagnetic-circuit method is employed to formulate the input-output relation of the power at transmit- and receive-coils, particularly in the presence of low-emissivity (e) glass. The equivalent circuit model of the low-e glass is developed to integrate the structure/material into circuit analysis.