Temperature analysis of thermoelectric device of Cu4SnS4 with two dimension by boundary element method

Abstract

Temperature distribution of a thermoelectric device composed of Cu/sub 4/SnS/sub 4/ compound in two-dimension is evaluated by the boundary element method (BEM). It is found that temperature distribution is strongly dependent on the length of the thermoelectric device. Temperature distribution shows very strong dependence of the direction of length of device when the length of device is very thin. In the case of small electric current density such as -1 A/cm/sup 2/, temperature distribution can be approximately expressed as the solution of Laplace equation.