Multi-cascode cell design for increased broadband power 0.1μm GaAs pHEMT MMICs up to V-band

Priya Shinghal, C. Duff, R. Sloan, S. Cochran
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Abstract

A comparative analysis of the DC and RF performance between single and multi-cascode cells for high frequencies (to V-band) and higher power MMIC operation is presented. This paper compares the power capabilities of a 0.1 μm GaAs pHEMT 2×25 μm single cascode cell with that of a 2×12 μm double-stacked (multi) cascode cell for the design of enhanced output power, broadband MMICs. A load line comparison for the two types of cascode cells shows that a similar maximum output power (Pdcmax) can be obtained from a 2×12 μm double-stacked cascode, when driven over a higher drain voltage swing at lower current, to that from a 2×25 μm single cascode. Moreover, measured data confirms higher Maximum Available Gain (MAG) up to 47 GHz and higher reverse isolation up to 75 GHz for double-stacked class-A operation. Also, a larger bandwidth can be achieved using the smaller devices with lower capacitances. Considering stability, 2×12 μm double-stacked configuration exhibits a lower negative output resistance as compared to the 2×25 μm single cascode. Thus, double-stacked (multi) cascode cell shows better RF performance, with no significant increase in unit cell layout width as compared to single cascode cell, leading to its potential utilization in the design of GaAs pHEMT based, high power MMICs such as Travelling Wave Amplifiers (TWA) up to V-band.
多级联码单元设计,提高宽带功率0.1μm GaAs pHEMT mmic至v波段
比较分析了单级和多级联码单元在高频(到v波段)和高功率MMIC操作下的直流和射频性能。本文比较了0.1 μm GaAs pHEMT 2×25 μm单级联码单元与2×12 μm双堆叠(多)级联码单元的功率性能,用于设计输出功率增强的宽带mmic。对两种级联码单元的负载线比较表明,当在较高的漏极电压摆幅和较低电流下驱动时,2×12 μm双层级联码与2×25 μm单层级联码的最大输出功率(Pdcmax)相似。此外,测量数据证实,对于双堆叠a类操作,最大可用增益(MAG)最高可达47 GHz,反向隔离最高可达75 GHz。此外,更大的带宽可以使用更小的器件和更低的电容来实现。考虑到稳定性,2×12 μm双堆叠结构比2×25 μm单级联码具有更低的负输出电阻。因此,与单级联码单元相比,双堆叠(多)级联码单元具有更好的射频性能,单元布局宽度没有显着增加,从而导致其在基于GaAs pHEMT的高功率mmic(如高达v波段的行波放大器(TWA))设计中的潜在应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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