Electronic control package model calibration using moiré interferometry

Abstract

Moiré interferometry is employed to test electronic control units, which are developed for automotive application utilizing transfer molding technology. The control units are subjected to a thermal cycle, and the two orthogonal in-plane displacement fields of the package cross-section are obtained at various temperatures. The results are used to verify and calibrate the complex 3-D finite element model of the units. The detailed experimental procedures including sample preparation are described. The modeling steps that lead to the calibrated finite element model are presented while comparing the experimental results with the numerical predictions.