Semimetallic Atomic Layer Deposited TiS2 Thin Films for Contact Resistance Improvement of MoS2-based Thin Film Transistor

Hwi Yoon, Jeongwook Seo, Sangyoon Lee, Jisang Yoo, Yunyong Nam, Jun Hyung Lim, Seung-min Chung, Hyungjun Kim
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Abstract

We introduced atomic layer deposition (ALD) of TiS2 as contact layer for MoS2 TFT to reduce the contact resistance. In this study, film properties of low temperature ALD TiS2 according to growth temperature was analyzed. ALD grown TiS2 showed semimetallic nature with low resistivity. In addition, change in properties of MoS2 after TiS2 deposition was investigated by various method. By applying ALD TiS2, we found significant increase in current level and Vth reduction which are attributed to semimetal nature of TiS2. These results imply that ALD TiS2 for contact formation is proper method to achieve high performance of MoS2 TFT.
半金属原子层沉积TiS2薄膜改善mos2基薄膜晶体管的接触电阻
我们引入了TiS2的原子层沉积(ALD)作为MoS2 TFT的接触层,以降低接触电阻。本研究分析了低温ALD TiS2薄膜随生长温度的变化特性。ALD生长的TiS2具有低电阻率的半金属性质。此外,采用多种方法研究了沉积TiS2后MoS2的性能变化。通过应用ALD TiS2,我们发现由于TiS2的半金属性质,电流水平显著增加,Vth降低。这些结果表明,ALD TiS2触点形成是实现MoS2 TFT高性能的合适方法。
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