TSV number minimization using alternative paths

Chun-Hua Cheng, Chih-Hsien Kuo, Shih-Hsu Huang
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引用次数: 5

Abstract

In a three-dimensional integrated circuit (3D IC) design, through-silicon-vias (TSVs) are used for data transfer across layers. However, TSVs act as obstacles during the stage of placement and routing and have a negative impact on chip yield. Therefore, TSV number minimization is an important topic for 3D IC design. In this paper, we point out that there often exist idle functional units and idle TSVs at each control step. If we use idle functional units and idle TSVs to form an alternative path to replace direct TSVs for data transfer, the number of TSVs can be reduced. Based on that observation, we present an ILP (integer linear programming) approach to formally draw up our problem. Given a high-level synthesis result and a clock period constraint, we perform post-processing to fully utilize alternative paths for TSV number minimization. Compared with previous work that minimizes the TSV number without considering alternative paths, experimental results show that our approach can further reduce 16.92% TSV number without affecting the circuit performances.
使用备选路径最小化TSV数量
在三维集成电路(3D IC)设计中,通过硅通孔(tsv)用于跨层数据传输。然而,在放置和布线阶段,tsv会成为障碍,并对芯片良率产生负面影响。因此,最小化TSV数是三维集成电路设计的一个重要课题。本文指出在每个控制步骤中往往存在闲置功能单元和闲置tsv。如果我们利用空闲的功能单元和空闲的tsv组成一条替代路径来代替直接的tsv进行数据传输,可以减少tsv的数量。基于这种观察,我们提出了一种整数线性规划(ILP)方法来正式地绘制我们的问题。给定高水平的合成结果和时钟周期约束,我们执行后处理以充分利用TSV数量最小化的替代路径。与以往在不考虑备选路径的情况下最小化TSV数的方法相比,实验结果表明,在不影响电路性能的情况下,我们的方法可以进一步减少16.92%的TSV数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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