Efficient Signal and Power Integrity Analysis Using Parallel Techniques

Tao Su, Xiaofeng Wang, Zhengang bai, V. Vennam
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Abstract

This paper describes the application of parallel algorithms for analyzing the electronic packages and PCB's in a fast and efficient manner. The effectiveness of multithreading at various stages of the analysis has been illustrated. The application of distributed computation to further accelerate the solution process is demonstrated.
基于并行技术的高效信号和功率完整性分析
本文介绍了并行算法在电子封装和PCB板分析中的应用。已经说明了多线程在分析的各个阶段的有效性。应用分布式计算进一步加快了求解过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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