Relation between inner voids of plastic IC packages and non-Newtonian flow characteristics of resin encapsulant

40th Conference Proceedings on Electronic Components and Technology Pub Date : 1990-05-20 DOI:10.1109/ECTC.1990.122255

S. Ichimura, K. Kinashi, T. Urano

{"title":"Relation between inner voids of plastic IC packages and non-Newtonian flow characteristics of resin encapsulant","authors":"S. Ichimura, K. Kinashi, T. Urano","doi":"10.1109/ECTC.1990.122255","DOIUrl":null,"url":null,"abstract":"The relationship between the flow characteristics of resin encapsulant an the number of inner voids in a plastic IC package was investigated. The number of inner voids decreased as the average transfer pressure rose. This indicated that the higher the viscosity of resin encapsulant in the molding die, the fewer the inner voids. However, the spiral flow (EMMI-1-66 standard), a general measure of resin encapsulant flow characteristics, is not proportional to the number of inner voids. This may be because resin encapsulant has non-Newtonian flow characteristics which change the viscosity with share rate. In comparison with the shear rate of an actual molding die, which is as low as 1 to 100/s in a runner or cavity, the shear rate of a molding die with spiral flow is as large as 100 to 1000/s. The viscosities in the low shear rate range were measured to get a good proportionality with the number of voids. In order to make the viscosity of the resin encapsulant higher in the low shear rate range, it is advisable to use fine filler or silicone flexibilizer.<<ETX>>","PeriodicalId":102875,"journal":{"name":"40th Conference Proceedings on Electronic Components and Technology","volume":"44 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th Conference Proceedings on Electronic Components and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1990.122255","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

Abstract

The relationship between the flow characteristics of resin encapsulant an the number of inner voids in a plastic IC package was investigated. The number of inner voids decreased as the average transfer pressure rose. This indicated that the higher the viscosity of resin encapsulant in the molding die, the fewer the inner voids. However, the spiral flow (EMMI-1-66 standard), a general measure of resin encapsulant flow characteristics, is not proportional to the number of inner voids. This may be because resin encapsulant has non-Newtonian flow characteristics which change the viscosity with share rate. In comparison with the shear rate of an actual molding die, which is as low as 1 to 100/s in a runner or cavity, the shear rate of a molding die with spiral flow is as large as 100 to 1000/s. The viscosities in the low shear rate range were measured to get a good proportionality with the number of voids. In order to make the viscosity of the resin encapsulant higher in the low shear rate range, it is advisable to use fine filler or silicone flexibilizer.<>

查看原文本刊更多论文

塑料IC封装内部空隙与树脂封装剂非牛顿流动特性的关系

研究了塑料集成电路封装中树脂封装剂的流动特性与内部空隙数的关系。随着平均传递压力的增加，内腔数量减少。这表明，树脂密封剂在成型模具中的粘度越高，内部空洞越少。然而，螺旋流动(EMMI-1-66标准)，树脂密封剂流动特性的一般测量，与内部空隙的数量不成比例。这可能是因为树脂密封剂具有非牛顿流动特性，其粘度随份额率的变化而变化。与实际成型模具在流道或型腔内的剪切速率低至1 ~ 100/s相比，螺旋流成型模具的剪切速率可达100 ~ 1000/s。对低剪切速率范围内的黏度进行了测量，得到了与孔隙数成良好比例关系的结果。在低剪切速率范围内，为使树脂包封剂的粘度更高，宜选用细填料或有机硅柔韧剂。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

40th Conference Proceedings on Electronic Components and Technology

CiteScore

3.10

自引率

0.00%

发文量