EDFAS Virtual Workshop Highlights

D. Grosjean
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Abstract

This column provides commentary about the 2020 EDFAS Virtual Workshop. Highlights from the three days of online sessions include a keynote address on the history of MEMS, a panel discussion on 3D packaging technologies, and nearly 60 technical papers and posters. Workshop attendees also had the opportunity to walk through a virtual Expo Hall and learn about new analytical tools and techniques and interact with equipment vendors.
EDFAS虚拟研讨会亮点
本专栏提供关于2020年EDFAS虚拟研讨会的评论。为期三天的在线会议的亮点包括关于MEMS历史的主题演讲,关于3D封装技术的小组讨论,以及近60篇技术论文和海报。与会者还将有机会参观虚拟展览厅,了解新的分析工具和技术,并与设备供应商进行互动。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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