Linlin Cai, Wangyong Chen, G. Du, Jinfeng Kang, Xing Zhang, Xiaoyan Liu
{"title":"Investigation of self-heating effect on stacked nanosheet GAA transistors","authors":"Linlin Cai, Wangyong Chen, G. Du, Jinfeng Kang, Xing Zhang, Xiaoyan Liu","doi":"10.1109/VLSI-TSA.2018.8403821","DOIUrl":null,"url":null,"abstract":"The self-heating behavior of horizontally stacked gate-all-around (GAA) nanosheet transistor is evaluated to investigate the spatial temperature profile and heat flux distribution considering the simple back-end-of line (BEOL). The impacts of related device geometry and material thermal conductivity are given to provide guidelines for mitigating self-heating effect (SHE) in device design. The results indicate that self-heating in nanoscale device should be attached great importance in achieving robust thermal management and precise reliability prediction.","PeriodicalId":209993,"journal":{"name":"2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2018.8403821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
The self-heating behavior of horizontally stacked gate-all-around (GAA) nanosheet transistor is evaluated to investigate the spatial temperature profile and heat flux distribution considering the simple back-end-of line (BEOL). The impacts of related device geometry and material thermal conductivity are given to provide guidelines for mitigating self-heating effect (SHE) in device design. The results indicate that self-heating in nanoscale device should be attached great importance in achieving robust thermal management and precise reliability prediction.