Copper grain growth in reduced dimensions

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) Pub Date : 2004-06-07 DOI:10.1109/IITC.2004.1345680

S. Brongersma, K. Vanstreels, W. Wu, W. Zhang, D. Ernur, J. D’Haen, V. Terzieva, M. Van Hove, T. Clarysse, L. Carbonell, W. Vandervorst, W. De Ceuninck, K. Maex

引用次数: 3

Abstract

The size effect observed for copper in reduced dimensions is studied by several different routes in order to further understand the relative influence of various scattering mechanisms and determine where to focus our efforts in order to reduce line resistance.

查看原文本刊更多论文

减小尺寸的铜晶粒生长

为了进一步了解各种散射机制的相对影响，并确定我们的工作重点，以减少线电阻，我们通过几种不同的途径研究了铜在降维中观察到的尺寸效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729)

自引率

0.00%

发文量