Mutual thermal effects of light-emitting diode with wafer-level packages

Abstract

Wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process with Si-MEMS technology. In this paper, thermal characteristics of wafer-level packaged LEDs with four multi-chips are investigated including mutual thermal effects due to the adjacent chips using both serial and parallel measurement methods.