Optimization of the Crosstalk of Crossing Microstrips in Multilayered Media Using Lumped Circuit Model

A. Mehdipour, M. Kamarei
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引用次数: 4

Abstract

In this paper the optimized structural parameters of the multilayer high-speed MMICs are obtained to minimize the crosstalk of the orthogonal microstrip lines in 1-20 GHz frequency range. The crosstalk is calculated by lumped circuit model of the cross-region using quasi-static methods and solving the related coupled integral equations. The spectral domain Green's function of the structure has been determined by utilization of the real-valued images technique. By using predetermined lumped circuit model, the effects of the physical parameters such as dielectric constant, height and number of layers and width of the traces have been investigated on the coupling factor of crossing interconnections
用集总电路模型优化多层介质中交叉微带串扰
在1 ~ 20ghz频率范围内,优化了多层高速mmic的结构参数,使正交微带线的串扰最小化。采用准静态方法,通过求解相关的耦合积分方程,建立交叉区域的集总电路模型,计算串扰。利用实值图像技术确定了该结构的谱域格林函数。采用预先确定的集总电路模型,研究了介电常数、层高、层数、走线宽度等物理参数对交叉互连耦合系数的影响
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