Connected component labeling on a one dimensional DSP array

Proceedings of IEEE. IEEE Region 10 Conference. TENCON 99. 'Multimedia Technology for Asia-Pacific Information Infrastructure' (Cat. No.99CH37030) Pub Date : 1999-09-15 DOI:10.1109/TENCON.1999.818667

M. F. Ercan, Y. Fung

引用次数: 7

Abstract

This paper presents a parallel implementation of connected component labeling algorithms for gray and binary images on a one-dimensional DSP array. The system is a distributed memory MIMD and all the algorithms are developed considering this platform. Performance results of several parallel connected component labeling methods are evaluated. The multi-DSP system has demonstrated a viable performance.

查看原文本刊更多论文

一维DSP阵列上的连接元件标记

本文提出了在一维DSP阵列上并行实现灰度和二值图像的连通分量标记算法。该系统是一个分布式存储MIMD，所有的算法都是在这个平台上开发的。对几种并联连接构件标记方法的性能结果进行了评价。该多dsp系统具有良好的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

Proceedings of IEEE. IEEE Region 10 Conference. TENCON 99. 'Multimedia Technology for Asia-Pacific Information Infrastructure' (Cat. No.99CH37030)

自引率

0.00%

发文量