Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565) Pub Date : 2001-10-29 DOI:10.1109/EPEP.2001.967653

Yong Wang, V. Jandhyala, C. Shi

引用次数: 25

Abstract

This paper presents a triangular surface mesh-based formulation of the Partial Element Equivalent Circuit (PEEC) approach. Rao-Wilton-Glisson (RWG) basis functions defined on triangular tessellations are used to model arbitrarily-shaped conducting structures via SPICE compatible netlists. This approach is potentially useful for modeling on-chip electromagnetic interactions.

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任意形状导电结构的耦合电磁电路仿真

本文提出了一种基于三角曲面网格的部分单元等效电路(PEEC)方法。定义在三角形镶嵌上的Rao-Wilton-Glisson (RWG)基函数通过SPICE兼容网络表对任意形状的导电结构进行建模。这种方法对芯片上电磁相互作用的建模有潜在的用处。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)

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