Pre-existing and process induced defects in high-k gate dielectrics ∼direct observation with EBIC and impact on 1/f noise∼

Motoyuki Sato, Jun Chen, T. Sekiguchi, T. Chikyow, J. Yugami, K. Ikeda, Y. Ohji
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引用次数: 1

Abstract

Microscopical investigation of leakage behaviors of Hf-based high-k gate stacks was achieved by means of electron-beam-induced current (EBIC) method. With this method, we could observe the pre-existing and stress induced defect in high-k. This pre-existing defect affect on MOSFET characteristics. We investigated in detail the relationship between the defect (in bulk high-k and interface) and 1/f noise on (110) and (100) substrates. The 1/f noise is strongly related to the degradation in the hole mobility due to the pre-existing defect or process integration damage. On the other hand, the 1/f noise of nMOSFETs is rerated to interface defects rather than electron mobility degradation.
高k栅极电介质中预先存在的缺陷和工艺引起的缺陷~ EBIC直接观察和对1/f噪声的影响~
采用电子束感应电流(EBIC)方法对高频基高k栅极堆的泄漏行为进行了微观研究。利用这种方法,我们可以观察到高k合金的预先存在缺陷和应力诱导缺陷。这种预先存在的缺陷会影响MOSFET的特性。我们详细研究了(110)和(100)衬底上的缺陷(高k和界面)与1/f噪声之间的关系。1/f噪声与由于预先存在的缺陷或工艺集成损坏而导致的孔迁移率下降密切相关。另一方面,nmosfet的1/f噪声与界面缺陷有关,而不是电子迁移率下降。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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