Chiweon Yoon, Hyunggon Kim, Seon-Kyoo Lee, Jin-Yup Lee, J. Song
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引用次数: 2
Abstract
In this paper, design challenges and key technologies to overcome the hurdles for the future 3D NAND are introduced. More specifically, state-of-the-art solutions for higher density, lower cost and higher bandwidth NAND is covered in detail.