EMC simulation of complex PCB inside a metallic enclosure and shielding effectiveness analysis

Abstract

In the present paper the Finite Integration Technique (FIT) in combination with the Partial Element Equivalent Circuit (PEEC) is employed to investigate the shielding performance of a metallic enclosure used for digital switching equipment. The current distribution on the power plane of a complex printed circuit board is used to excite the system. The effect of apertures’ shape and configuration on the value of the radiated Electric field is studied. It is shown that dividing a specified area into a combination of multiple apertures may reduce the value of the radiated emissions and therefore improve the shielding effectiveness. The usage of honeycomb panels is finally investigated.