{"title":"Laser applications In microelectronics","authors":"Vincent J. Zaleckas","doi":"10.1364/cleos.1976.tub4","DOIUrl":null,"url":null,"abstract":"This paper reviews the various applications for which lasers have been employed in the microelectronics industry. The applications encompass the integrated circuit technologies, including SICs and thin and thick film HICs. General topics covered include the fabrication, inspection, and repair of masks, wafer scribing, and passive and active trimming of devices.","PeriodicalId":301658,"journal":{"name":"Conference on Laser and Electrooptical Systems","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on Laser and Electrooptical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/cleos.1976.tub4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reviews the various applications for which lasers have been employed in the microelectronics industry. The applications encompass the integrated circuit technologies, including SICs and thin and thick film HICs. General topics covered include the fabrication, inspection, and repair of masks, wafer scribing, and passive and active trimming of devices.