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Electrode Formation Using Electrodeposition and Direct Bonding for 3D Integration

Novel Structured Metallic and Inorganic Materials Pub Date : 1900-01-01 DOI:10.1007/978-981-13-7611-5_39
T. Kaneda, H. Shinohara, A. Okada, K. Matsunaga, S. Shoji, M. Saito, H. Nishikawa, J. Mizuno
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采用电沉积和直接键合的3D集成电极形成
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Novel Structured Metallic and Inorganic Materials
Novel Structured Metallic and Inorganic Materials
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