An Overview of Design, Fabrication, and Cooling Techniques of 3D-ICs

Abstract

3D-IC technology is the most promising technique to overcome moore’s law failure and deliver the needed integration density for the coming decades. This technology suffers from severe thermal management issues that may result in real reliability issues. These issues require the use of new cooling techniques. In this paper, the different conventional cooling techniques for thermal management are discussed. Liquid cooling using embedded micro-channels are analyzed theoretically and verified experimentally.