Simulation on Evaporation of Copper Droplet in Vacuum

Abstract

Evaporation of droplets in vacuum circuit breaker has impact on dielectric strength recovery and breaking ability. In this paper, we use simulation to study impact of different parameters on evaporation. We found that the evaporation process can be separated into two parts, fast evaporation and stable evaporation. This difference is caused by the saturated vapor pressure and it restrains the evaporation. By changing initial speed, temperature, angle and number of droplets, evaporation process shows different pictures.