A. Nakagawa, T. Matsudai, T. Matsuda, M. Yamaguchi, T. Ogura
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引用次数: 23
Abstract
We have previously proposed and analyzed the MOSFET-mode operation of ultra-thin wafer PTIGBTs in (T. Matsudai et. al., Proc. of ISPSD'02, p.258). The present paper, for the first time, presents an analytical theory of MOSFET-mode operation, and shows that the safe operating area is determined by a mechanism similar to the second breakdown of npn bipolar transistors. The present paper also experimentally demonstrates, for the first time, that the MOSFET-mode IGBTs are strongly effective for soft switching applications. The developed MOSFET-mode 900 V 60 A thin wafer trench gate PTIGBTs have reduced turn-off loss by 55% at 125/spl deg/C, compared with the conventional (4th generation) soft switching PTIGBTs.
我们之前已经提出并分析了超薄晶片PTIGBTs的mosfet模式工作(T. Matsudai et. al., Proc. of ISPSD'02, p.258)。本文首次提出了mosfet模式工作的解析理论,并表明安全工作区域是由类似于npn双极晶体管二次击穿的机制决定的。本文还首次通过实验证明了mosfet模式igbt在软开关应用中是非常有效的。与传统的(第四代)软开关PTIGBTs相比,开发的mosfet模式900 V 60a薄晶片沟槽栅极PTIGBTs在125/spl度/C时的关断损耗降低了55%。