Interactions between Vias and the PCB Power-Bus

Abstract

In this paper, a method for the investigation of the interactions between a via and a PCB power-bus is described. Starting with an initial via model and two types of de-embedding algorithm, which extract the scattering parameters of the via, the elements of the via model are derived. After that the influence of the via on the power-bus impedance and the interactions between the via and the power-bus are described.