Comparative analysis of 300 mm FAB architectures impact of equipment sets on wafer cost and dynamic performance

Abstract

A semiconductor fabricator is a highly complex system that hosts the process tools capable of manufacturing IC product devices based upon their process flows. A typical process flow for a 0.15 /spl mu/m logic process consists of 300 to 400 steps with 22 to 24 mask steps. A variety of equipment sets and organizational architectures are possible for any process flow. The results of a comparative analysis of two such 300 mm FAB architectures are presented in this report. The impact of equipment sets on fab Sizing, Cost, and Performance are described as a function of operating characteristics.