STEP BUNCHING OF GAAS(111) VICINAL SURFACES DURING THE HIGH-TEMPERATURE ANNEALING PROCESS

Mathematical modeling in materials science of electronic component Pub Date : 2022-10-22 DOI:10.29003/m3072.mmmsec-2022/74-77

A. Spirina, N. Shwartz

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Abstract

In this work, simulation of GaAs(111) high-temperature annealing has been carried out. The effect of gallium droplets on the surface relief evolution of the vicinal GaAs(111) substrates with different misorientation angles during annealing in a wide temperature range is analyzed

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高温退火过程中gaas(111)邻近表面的步聚

本文对GaAs(111)高温退火过程进行了模拟。分析了镓液滴对不同取向角的相邻GaAs(111)衬底在宽温度范围内退火过程中表面起伏演化的影响

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Mathematical modeling in materials science of electronic component

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