Considerations of TSV effects on next-generation super-high-speed transmission and power integrity design for 300A-class 2.5D and 3D package integration

Abstract

An analysis of through silicon via (TSV) effects on next-generation super-high-speed transmission and power integrity package design for 2.5D modules with a highperformance central processing unit (CPU) or other 300A-class LSI mounted and 3D LSI is described in this paper.