System-in-Package Matching Network for RF Wireless Transceivers

Abstract

The experimental and simulative investigation, as well as measurement results of an on-package planar transformers is presented. The proposed transformer is designed as part of an impedance matching network for a center frequency of 750 MHz. The transformer is designed using FEM simulators and produced on a 3-layer core-less package technology. The transformer inductors reach Q-factors between 25 and 35, and coupling factor around 0.6. Simulations and measurement results present a good agreement and show that the use of on-package transformers is a promising alternative for the currently standard integrated transformers.