System-in-Package Matching Network for RF Wireless Transceivers

Graciele Batistell, Timo Holzmann, H. Sterner, J. Sturm
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引用次数: 2

Abstract

The experimental and simulative investigation, as well as measurement results of an on-package planar transformers is presented. The proposed transformer is designed as part of an impedance matching network for a center frequency of 750 MHz. The transformer is designed using FEM simulators and produced on a 3-layer core-less package technology. The transformer inductors reach Q-factors between 25 and 35, and coupling factor around 0.6. Simulations and measurement results present a good agreement and show that the use of on-package transformers is a promising alternative for the currently standard integrated transformers.
用于射频无线收发器的系统级包匹配网络
介绍了一种封装式平面变压器的实验、仿真研究和测量结果。提出的变压器被设计为阻抗匹配网络的一部分,中心频率为750mhz。变压器采用有限元仿真设计,采用三层无芯封装技术生产。变压器电感的q系数在25 ~ 35之间,耦合系数在0.6左右。仿真和测量结果显示出良好的一致性,并表明使用非封装变压器是目前标准集成变压器的一个有希望的替代方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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