Processing Requirements for Mass Production of Microwave Hybrid Integrated Circuits

Abstract

The works undertaken by L.T.T. to master the different operations for low cost and mass production of MIC (in TO 8 package) components are described. A certain number of devices representative of the whole of microwave components one can realize in MIC technology were selected. They were used both for a comparative study of the explored technologies (from both technical and economical points of view) and for systematic reliability and reproductibility tests. The most performing technologies will be described in detail.