Trends in next generation thermal imaging using integrated focal planes

Lloyd M. Candell, Paul J. Beckett
{"title":"Trends in next generation thermal imaging using integrated focal planes","authors":"Lloyd M. Candell, Paul J. Beckett","doi":"10.1364/cleos.1976.thc5","DOIUrl":null,"url":null,"abstract":"The implications of high density focal plane arrays (>5000 detectors) upon the design and performance of next generation thermal imaging systems are discussed. The system design tradeoffs with respect to increased fields of view, improved sensitivity, and resolution are presented.","PeriodicalId":301658,"journal":{"name":"Conference on Laser and Electrooptical Systems","volume":"183 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on Laser and Electrooptical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/cleos.1976.thc5","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

The implications of high density focal plane arrays (>5000 detectors) upon the design and performance of next generation thermal imaging systems are discussed. The system design tradeoffs with respect to increased fields of view, improved sensitivity, and resolution are presented.
下一代集成焦平面热成像的发展趋势
讨论了高密度焦平面阵列(>5000个探测器)对下一代热成像系统设计和性能的影响。系统设计方面的权衡,增加了视野,提高了灵敏度,并提出了分辨率。
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