Modeling bond wires for millimeter wave RFIC design

Abstract

This paper discusses how bond wires can be accurately modeled for circuits operating at several 10 GHz. To obtain exact results a more sophisticated model than the commonly-used inductor with around 0.8 nH/mm is required. An edge-based multiple conductor transmission line (mtline) model is presented, and it is demonstrated how its parameters can be extracted from EM simulations. A comparison of the mtline model with a lumped components model demonstrates the advantages of the mtline approach.