The effect of polymer package materials on device total dose response at low dose rates

RADECS 97. Fourth European Conference on Radiation and its Effects on Components and Systems (Cat. No.97TH8294) Pub Date : 1997-09-15 DOI:10.1109/RADECS.1997.698904

S. Dowling, D. Strobel

引用次数: 0

Abstract

The effect of eight encapsulant materials on bipolar device total dose response, at low (0.01 rads s/sup -1/[Si]) dose rates was studied. Each material was applied to devices with and without their passivation layer. Gain degradation was studied.

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低剂量率下聚合物封装材料对器件总剂量响应的影响

在低剂量率(0.01 rads s/sup -1/[Si])下，研究了8种封装材料对双极器件总剂量响应的影响。每种材料分别应用于有钝化层和没有钝化层的器件。对增益退化进行了研究。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

RADECS 97. Fourth European Conference on Radiation and its Effects on Components and Systems (Cat. No.97TH8294)

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