When should on-chip inductance modeling become necessary for VLSI timing analysis?

Li-Fu Chang, Keh-Jeng Chang, R. Mathews
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引用次数: 2

Abstract

Copper-based 0.13 /spl mu/m technologies targeting System-on-a-Chip (SoC) are becoming available for VLSI designs, while aluminum-based 0.18 /spl mu/m and 0.25 /spl mu/m technologies are being used by main-stream, high-end VLSI design groups. Besides material change and technology scaling, other factors that make on-chip inductance modeling become more important are: integration level, harmonic frequency, design style, et al. In essence, many process and layout parameters of today's VLSI designs can have potentially first-order effects on how much inductance modeling affects the timing of a critical net. In this paper, our research result indicate the most critical parameters are material property, process feature size, interconnect length, and driver size. We use typical but critical signal nets in VLSI chips, model them by 3-D RLC extractor, and simulate them by SPICE. This methodology can help identify a proper subset of nets that require detailed RLC-based timing analysis. In this way, more efficient timing analysis without considering inductance modeling (e.g. for SoC) can be performed for other nets.
针对片上系统(SoC)的铜制0.13 /spl mu/m技术已可用于VLSI设计,而主流高端VLSI设计团队正在使用基于铝的0.18 /spl mu/m和0.25 /spl mu/m技术。除了材料的变化和技术的缩放,使片上电感建模变得更加重要的其他因素是:集成度、谐波频率、设计风格等。从本质上讲,当今超大规模集成电路设计的许多工艺和布局参数可能对电感建模对关键网络时序的影响程度产生潜在的一阶影响。在本文中,我们的研究结果表明,最关键的参数是材料性能,工艺特征尺寸,互连长度和驱动器尺寸。利用VLSI芯片中典型但关键的信号网络,利用三维RLC提取器对其进行建模,并利用SPICE对其进行仿真。这种方法可以帮助确定需要详细的基于rlc的时间分析的网络的适当子集。通过这种方式,可以在不考虑电感建模(例如SoC)的情况下对其他网络进行更有效的时序分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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