THE INFLUENCE OF SHOT PEENING ON THE STRESS STATE IN THE ADHESIVE LAYER AND THE LOAD CAPACITY OF ADHESIVE JOINTS

W. Zielecki, J. Godzimirski, E. Ozga
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引用次数: 0

Abstract

The aim of the article was to determine the influence of shot peening of the outer surface of the overlap on the stress state in the adhesive layer and the load capacity of single lap adhesive joints made of EN AW-2024-T3 aluminum alloy. Experimental investigations and numerical simulations were carried out. According to the results of experimental analyses, shot peening with balls with a diameter of 1 mm for 120 s with a compressed air pressure of 0.5 MPa increased the load capacity of the adhesive joints by 33%. Numerical simulations have shown that shot peening, by deforming the joined elements, reduces the stress perpendicular to the surface of the adhesive layer which results in a reduction of equivalent (von Misses) stress and an increase in strength of adhesive joints.
喷丸处理对粘接层应力状态及粘接接头承载能力的影响
本文的目的是确定重叠外表面喷丸处理对EN AW-2024-T3铝合金单搭接粘接接头粘接层应力状态和承载能力的影响。进行了实验研究和数值模拟。实验分析结果表明,在0.5 MPa的压缩空气压力下,直径为1 mm的钢球喷丸强化120 s,可使粘接接头的承载能力提高33%。数值模拟结果表明,喷丸强化通过使连接单元变形,降低了垂直于粘合层表面的应力,从而降低了等效应力,提高了粘合接头的强度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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