Addressing supply chain risks of microelectronic devices through computer vision

Zhenhua Chen, Tingyi Wanyan, Ramya Rao, Benjamin Cutilli, J. Sowinski, David J. Crandall, R. Templeman
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引用次数: 4

Abstract

Microelectronics are at the heart of nearly all modern devices, ranging from small embedded integrated circuits (ICs) inside household products to complex microprocessors that power critical infrastructure systems. Devices often consist of numerous ICs from a variety of different manufacturers and procured through different vendors, all of whom may be trusted to varying degrees. Ensuring the quality, safety, and security of these components is a critical challenge. One possible solution is to use automated imaging techniques to check devices' physical appearance against known reference models in order to detect counterfeit or malicious components. This analysis can be performed at both a macro level (i.e., ensuring that the packaging of the IC appears legitimate and undamaged) and a micro level (i.e., comparing microscopic, transistor-level imagery of the circuit itself to detect suspicious deviations from a reference model). This latter analysis in particular is very challenging, considering that modern devices can contain billions of transistors. In this paper, we review the problem of microelectronics counterfeiting, discuss the potential application of computer vision to microelectronics inspection, present initial results, and recommend directions for future work.
通过计算机视觉解决微电子设备的供应链风险
微电子是几乎所有现代设备的核心,从家用产品中的小型嵌入式集成电路(ic)到为关键基础设施系统供电的复杂微处理器。设备通常由来自各种不同制造商的大量ic组成,并通过不同的供应商采购,所有这些供应商都可能在不同程度上受到信任。确保这些组件的质量、安全性和安全性是一个关键的挑战。一种可能的解决方案是使用自动成像技术根据已知的参考模型检查设备的物理外观,以检测假冒或恶意组件。这种分析可以在宏观层面(即,确保IC的封装看起来合法且完好无损)和微观层面(即,比较电路本身的微观晶体管级图像,以检测与参考模型的可疑偏差)进行。考虑到现代设备可以包含数十亿个晶体管,后一种分析尤其具有挑战性。在本文中,我们回顾了微电子伪造问题,讨论了计算机视觉在微电子检测中的潜在应用,介绍了初步结果,并建议了未来工作的方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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